Bijan Nowroozi
Bijan Nowroozi is Chief Technical Officer of The Open Compute Project Foundation and has more than 30 years of experience with hardware and software development, signal processing, networking, and research with technology companies. Prior to The OCP Bijan developed mission critical infrastructure and was on the leading-edge standards and technology development in multiple technology waves including edge computing, AI/ML, optical/photonics, quantum, RF, wireless, small cells, UAV’s, GIS, HPC, network security, energy and more.
Steven Brightfield
Steven Brightfield has over 20 years of success defining and bringing to market new semiconductor products with companies such as Qualcomm, SiMA.ai. LSI Logic, Plessey and Zoran for mobile, AR/VR, wearable, edge ML, cable/sat set-top and digital camera chips. He has 10 years of experience launching programmable semiconductor IP cores for CPU/GPU/DSP/NPUs at LSI Logic,ARC, MIPS, Silicon Arts, Improv, and BOPS and licensing into end products that are ubiquitous today. Steven’s technical foundation in digital signal processing led to using (DSPs in innovative products that digitized the world of speech, audio, multimedia, graphics, camera and video processing, most recently applying AI/ML in these same domains. Steven recently joined the BrainChip leadership team to further drive BrainChip’s brand recognition, go-to-market strategy and customer acquisition as BrainChip enters a growth phase for their flagship Akida products. Steven has a Bachelor of Science in Electrical Engineering from Purdue University.
Story Raised $80M to Build Blockchain to Prevent Copyright Theft
Steve Mills
Steve Mills is a Mechanical Engineer who has dedicated over 25 years to the development of IT hardware in the enterprise and hyperscale space. After tours at DELL and Storspeed, he joined Meta in 2012 and is currently a Technical Lead for Data Center and Hardware Interfaces. He also serves on the Open Compute Project Steering Committee representing the Cooling Environments Project. He has 48 US patents and is an author of eight papers covering the packaging and cooling of electronics.